Electronic BP

Tin-silver is a lead-free chemistry that creates critical interconnections in electronic devices while providing industry-leading performance; double the productivity; and a novel recycling process for enhanced sustainability. As recent changes in electronics industry regulations drive manufacturers to find a lead-free alternative to tin-lead solder for wafer bumping processes, tin-silver plating chemistry has stepped in to fill the role. Tin-silver solder plating can be used for flip-chip processes, as well as for applications such as capping Cu pillars, or producing micro-bumps that are required for interposer integration and advanced 3D packaging applications.

How does the SOLDERON™ BP TS 6000 Tin-Silver product line address the needs for a lead-free plating chemistry? +

SOLDERON™ BP TS 6000 Tin-Silver is a lead-free plating chemistry formulated using safer chemicals and processes to enable the next generation of high-performance electronic devices. Removing lead from solders used in electronics is difficult because of lead’s unique properties that ensure reliable device performance. SOLDERON™’s unique formulation has been proven to meet the industry’s stringent performance needs in a high-volume manufacturing environment.

Why is SOLDERON™ BP TS 6000 Tin-Silver groundbreaking? +

SOLDERON™ BP TS 6000 is the latest generation of the SOLDERON™ BP Tin-Silver product family. It has been optimized to handle a wide range of solder bump plating applications, ranging from conventional C4 bumping to demanding next-generation, fine-pitch applications such as Cu pillar and micro-bumps used in 2.5D and 3D-IC packaging technologies. SOLDERON™ BP TS 6000 delivers industry-leading plating rates and maximum process flexibility for flip-chip packages and interconnects. Its enhanced plating performance, bath stability and ease of use enable the industry’s widest process window with the most robust process flexibility and a highly competitive cost of ownership (COO).

How does SOLDERON™ BP Tin-Silver address the needs of advanced packaging applications? +

SOLDERON™ BP Tin-Silver delivers industry-leading plating rates, extraordinary feature and compositional uniformity, and maximum process flexibility for flip-chip packages and interconnects used in advanced electronic packages. Its plating capabilities, bath stability and ease of use enable the industry’s widest process flexibility and a competitive COO. This single formulation is capable of plating speeds substantially faster than baseline competitive chemistry. The tunable nature of the Ag composition in this formulation makes it suitable for a number of applications, allowing it to address different processing requirements. No other commercially available SnAg can meet this performance from a single formulation.

The SOLDERON™ BP TS 6000 Team: A Global Effort

• Jeff Calvert	• Regina Cho	• Jin-Sil Choi	• Lou Grippo
• Masaaki Imanari	• Yoon-Joo Kim	• Inho Lee	• Yil-Hak Lee
• Won-Hyun Lee	• Sang-Min Park	• Jonathan Prange	• Yi Qin
• Alex Saniuk	• Taylor Wang	• Julia Woertink	• Ju-Mi Yun
• Sam Epstein	• Scott Shpunt	• Kristen Finnemore	• Yung-Rai Lee
• Jim MacDuff	• Brianna Gagnon	• Jianwei Dong	• Brandon Sherzer

About the Edison Awards™

The Edison Awards™ have recognized and honored some of the most innovative products and business leaders in the world and is among the most prestigious accolades honoring excellence in new product and service development, marketing, design and innovation.

About the R&D 100 Awards

Widely recognized as the “Oscars of Invention”, the
R&D 100 Awards identify and celebrate the top technology products of the year. Past winners have included sophisticated testing equipment, innovative new materials, chemistry breakthroughs, biomedical products, consumer items, and high-energy physics. The R&D 100 Awards spans industry, academia, and government-sponsored research.