Tin-silver is a lead-free chemistry that creates critical interconnections in electronic devices while providing industry-leading performance; double the productivity; and a novel recycling process for enhanced sustainability. As recent changes in electronics industry regulations drive manufacturers to find a lead-free alternative to tin-lead solder for wafer bumping processes, tin-silver plating chemistry has stepped in to fill the role. Tin-silver solder plating can be used for flip-chip processes, as well as for applications such as capping Cu pillars, or producing micro-bumps that are required for interposer integration and advanced 3D packaging applications.How does the SOLDERON™ BP TS 6000 Tin-Silver product line address the needs for a lead-free plating chemistry? +
SOLDERON™ BP TS 6000 Tin-Silver is a lead-free plating chemistry formulated using safer chemicals and processes to enable the next generation of high-performance electronic devices. Removing lead from solders used in electronics is difficult because of lead’s unique properties that ensure reliable device performance. SOLDERON™’s unique formulation has been proven to meet the industry’s stringent performance needs in a high-volume manufacturing environment.Why is SOLDERON™ BP TS 6000 Tin-Silver groundbreaking? +
SOLDERON™ BP TS 6000 is the latest generation of the SOLDERON™ BP Tin-Silver product family. It has been optimized to handle a wide range of solder bump plating applications, ranging from conventional C4 bumping to demanding next-generation, fine-pitch applications such as Cu pillar and micro-bumps used in 2.5D and 3D-IC packaging technologies. SOLDERON™ BP TS 6000 delivers industry-leading plating rates and maximum process flexibility for flip-chip packages and interconnects. Its enhanced plating performance, bath stability and ease of use enable the industry’s widest process window with the most robust process flexibility and a highly competitive cost of ownership (COO).How does SOLDERON™ BP Tin-Silver address the needs of advanced packaging applications? +
SOLDERON™ BP Tin-Silver delivers industry-leading plating rates, extraordinary feature and compositional uniformity, and maximum process flexibility for flip-chip packages and interconnects used in advanced electronic packages. Its plating capabilities, bath stability and ease of use enable the industry’s widest process flexibility and a competitive COO. This single formulation is capable of plating speeds substantially faster than baseline competitive chemistry. The tunable nature of the Ag composition in this formulation makes it suitable for a number of applications, allowing it to address different processing requirements. No other commercially available SnAg can meet this performance from a single formulation.
The SOLDERON™ BP TS 6000 Team: A Global Effort
|• Jeff Calvert||• Regina Cho||• Jin-Sil Choi||• Lou Grippo|
|• Masaaki Imanari||• Yoon-Joo Kim||• Inho Lee||• Yil-Hak Lee|
|• Won-Hyun Lee||• Sang-Min Park||• Jonathan Prange||• Yi Qin|
|• Alex Saniuk||• Taylor Wang||• Julia Woertink||• Ju-Mi Yun|
|• Sam Epstein||• Scott Shpunt||• Kristen Finnemore||• Yung-Rai Lee|
|• Jim MacDuff||• Brianna Gagnon||• Jianwei Dong||• Brandon Sherzer|
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